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DLP Announces All-New DLP Pico Chip Architecture - Brighter and More Efficient

Related: DLP, Projector
DLP Announces All-New DLP Pico Chip Architecture - Brighter and More Efficient

Texas Instruments DLP Products has announced a new, groundbreaking platform for its leading DLP Pico technology. The new pixel architecture allows manufacturers to develop even smaller products that feature pico projection with substantial increases in brightness, efficiency and resolution. And for consumers, this new platform will mean a more compelling and easier way to instantly enjoy and share the latest content from more devices than ever.

"We are at an all-time peak of new pico products and categories here at CES, and are
experiencing the start of a bright technical future for development on our new platform," said Frank Moizio, Business Unit Manager DLP Pico. "These factors, plus the undisputable human desire to own and share content in the largest format from the smallest devices, will together drive increased consumer adoption in the pico display space over the next year."

Smartphone, tablet and other mobile device manufacturers and carriers that are seeking maximum power efficiency paired with valuable, content-driven features stand to benefit most from this new DLP Pico platform. Some of the key advantages for products built on the new architecture will include:

- As much as 30% higher brightness, with greater efficiency
- Up to 50% less power consumption
- 2x the resolution in the same sized chip

Even prior to the announcement of these next-level capabilities, Pacific Media Associates (PMA) has predicted a worldwide pico projector market forecast of 8 million units by 2015 pointing to the category's increasing popularity. This new DLP Pico platform is already available for manufacturer testing. The first consumer-ready products to incorporate the features are expected as early as the end of 2013.

On display at the TI DLP demo suite during CES 2013, these groundbreaking advancements aim to bring robust, usable projection capabilities to more devices and product categories than may have seemed possible only a few years ago.

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